| 摘要 |
PURPOSE:To prevent contact of the mirror surface of a wafer with separately provided ribs in conveying and in transportation in a pattern housed in a case and to protect the wafer from contamination and breakdown, by providing a groove in a flexible supporting mechanism, and shifting the central line of the groove from the central line of the interval between ribs. CONSTITUTION:A wafer W is insered into a gap between separately provided ribs 16 and 17 from the open upper part of a basket 1. The wafer is supported with flexible supporting mechanisms 18 and 19. A groove 21 is provided so that it is shifted from a central line 22 between the separately provided ribs 16. Since the wafer W is supported on the bottom of such a groove 21, the wafer W is inclined so that only one surface is in contact with the separately provided rib 16. Therefore, the mirror surface of the wafer W is held in the basket 1 in the non-contact state. Since vibration in conveying the wafer W is absorbed with the flexible supporting mechanism 18, shock is not applied to the wafer, and breakdown is prevented. |
