发明名称 |
PROCESS AND COMPOSITION FOR PREPARING PRINTED CIRCUIT THROUGH-HOLES FOR METALLIZATION |
摘要 |
Disclosed herein is a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) for subsequent metallization, in which the through-hole surfaces are treated with a substantially water-immiscible organic liquid which acts upon the insulating substrate of the board, and preferably in the form of a substantially homogeneous, clear mixture comprised of the water-immiscible organic liquid, water, an alkali metal compound and a surfactant component, followed by treatment of the through-hole surfaces with an alkaline permanganate solution. The process can be used as a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process. |
申请公布号 |
WO8910431(A1) |
申请公布日期 |
1989.11.02 |
申请号 |
WO1988US04413 |
申请日期 |
1988.12.09 |
申请人 |
MACDERMID, INCORPORATED |
发明人 |
KUKANSKIS, PETER, E.;D'AMBRISI, JOSEPH, J.;KUZMIK, JOHN, J. |
分类号 |
C11D7/60;C23C18/20;C23C18/22;C23C18/28;H05K3/00;H05K3/26;H05K3/42;H05K3/46;(IPC1-7):C23C18/22;C23C18/30;C23C30/00;C23C18/26 |
主分类号 |
C11D7/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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