| 摘要 |
PURPOSE:To increase the formed quantity of Nb3Sn so as to shorten heat treatment time and prevent the formation of a Cu-Sn compound so as to facilitate the manufacture by forming a Cu plating layer and the plating layer of superconductive intermetallic compound formation element in order around wire material which is obtained by means of contracting the diameter of an in situ ingot. CONSTITUTION:The diameter of an in situ ingot 10 is contracted so as to obtain an in situ wire 13. Next, around the outer surface of the in situ wire 13, a Cu plating layer 14 is formed and further around the outer circumference, a Sn plating layer 15 is formed so as to obtain plating composite wire 16. After plating treatment ends, the plating composite wire 16 is heated at more 100 deg.C and less than the fusing point of Sn for dozens of hours to hundreds of hours and as well it is subjected to preheat treatment of heating at 300 to 450 deg.C for dozens of hours. Next, it is heated at 500 to 650 deg.C for dozens of hours to hundreds of hours. By this heat treatment, the fiber-shaped filament of Nb reacts on Sn so that the filament of a Nb3Sn superconductive intermetallic compound is formed so as to be able to obtain superconductive wire 17.
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