| 摘要 |
<p>PURPOSE:To prevent loss due to pyroelectricity in a pyroelectric material by installing an antistatic mechanism spraying an ionized gas against the pyroelectric body material treated to the rear of a treating section treating the pyroelectric body material. CONSTITUTION:Wafers 1 housed in a wafer cassette 13 are carried into a treating chamber 10 in succession and etched and treated, and carried into a vacuum spare chamber 12. The wafers 1 brought into the vacuum spare chamber 12 are placed onto a base plate composed of a conductive material. An antistatic mechanism 16 is mounted to the upper section of the vacuum spare chamber 12, and sprays ionized air against the wafers 1 from an upper section. Pyroelectricity generated with a temperature drop is discharged rapidly to the wafers 1 consisting of a pyroelectric material through an ionized gas and the base plate having conductivity.</p> |
