Method of packaging a semiconductor laser and photosensitive semiconductor device

摘要

A method of constructing a semiconductor laser includes producing a lead frame having a central lead which is used as a die pad at its central portion and two outside leads connected to the central lead by tie bars, mounting a semiconductor laser chip and a light receiving chip on the central lead of the lead frame, connecting the semiconductor laser chip and the light receiving chip to respective outside leads with wires, sealing portions of the leads, the wires, and both chips in a transparent package, and cutting the tie bars to disconnect the outside leads from the central lead.