| 摘要 |
PURPOSE:To solder with high reliability by using the preflux contg. a terpene phenol resin and an alkylimidazole compound. CONSTITUTION:An alcohol soluble terpene phenol resin is used as the base resin for a preflux. Thus resin is of copolymer with the terpene class of an alphapinene, etc., and that class of a phenol, etc., and whose mean molecular weight is about 400-1200. However this softening point is preferably at 80-145 deg.C. The soldering of a surface packaging part, etc., is effective by using the flux having the component within the range of 0.5-20% against the solid part of the terpene phenol resin on the additional amt. of the alkylimidazole compound of a 2-alkylimidazole, zinc halide, etc. The soldering of high reliability of an electronics instrument, etc., can thus be made. |
