Baseplate for producing metallised holes in printed circuit boards or substrates, and a method for producing the baseplate

摘要

It is known for holes in baseplates or substrates to be filled with paste containing metal, in that the paste is sucked through the holes. The printed circuit boards or substrates are for this purpose placed on baseplates which are located above a through-suction chamber, the baseplates being specifically manufactured for a printed circuit board or consisting of a baseplate with holes which are arranged like a grid and into which metal pins are inserted. A baseplate which can be used in a versatile manner is specified. In addition, a method is specified describing how the baseplate can be produced. The baseplate has drilled holes arranged like a grid. Support cells, on which the substrate or printed circuit board rests, are produced on the baseplate by coating with a photopolymer, exposure with an exposure mask, and developing. The exposure mask is produced such that the support cells do not coincide with the holes in the substrate or in the printed circuit board. Production of metallised holes by means of screen printing in order to produce through-plated holes for thick-film substrates which are printed on both sides.