| 摘要 |
<p>An electronic circuit package comprises a flat substrate body 1, the said body supporting a metallised interconnection pattern 2, the pattern being arranged with contact pads such that an electronic circuit module 7 may be connected thereto, in which the substrate body 1 is formed of aluminum nitride. The module 7 may be covered over with a wall 14 and a lid 16. This then gives hermetic sealing with the ability to dissipate high electrical power and it enables thermal mismatch problems to be minimised. <IMAGE></p> |
