发明名称 A carrier assembly and a process for producing a carrier assembly for a semi-conductor package.
摘要 <p>A carrier assembly for releasably supporting a semi-conductor package (47) including a package body (44, 48) and a plurality of leads (50) extending from the body comprises a rigid carrier (82) having retaining means (118, 120) arranged for releasably securing the package against vertical movement relative to the carrier. Inter-connection means for attachment to the leads at the end portions thereof for substantially fixing the end portions with respect to one another are also provided and comprise two substantially identical dielectric frames (16, 46) positioned on opposite sides of the leads and fastened together with the leads therebetween. First registration means (34, 36) provided by the inter-connection means and second registration means (110, 112) provided by the carrier are positioned to engage one another to secure the inter-connection means against transverse movement relative to the carrier whereby to align the end portions of the leads of the semi-conductor package with respect to the carrier.</p>
申请公布号 EP0338706(A2) 申请公布日期 1989.10.25
申请号 EP19890303491 申请日期 1989.04.10
申请人 CONTROL DATA CORPORATION 发明人 RIES, RICHARD DEAN;SMITH, DEWEY WILLIAM;PAYTON, SPERO
分类号 H01L21/66;H01R33/97;H01L21/50;H01L21/52;H01L21/673;H01L23/28;H01L23/32;H01L25/10;H01L25/18 主分类号 H01L21/66
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