| 摘要 |
The invention proposes a process and equipment for the thermal treatment of semiconductor materials which contains an isothermal, all-round heated process tube in a so-called "closed-tube" process using a compact construction of the furnace, whereby a defined process gas atmosphere is present in the process chamber from the very start of the process and a reverse diffusion is prevented. A double-tube system is used here with an adjustable interspace rinsing, i.e. the use of the so-called "rapid cassette" in cold blowing. Applications for the invention are in particular the oxidation, diffusion, deposition and tempering of semiconductor discs. |
