| 摘要 |
PURPOSE:To enable adhering, fixing, and removing a wafer in a short time and by a simple method without deteriorating a holding jig, by fixing the water to a transparent plate with a film with viscous bond applied on both surfaces thereof interposed therebetween and removing said wafer by hardening said viscous bond by applying ultraviolet rays thereto after its processing. CONSTITUTION:A transparent plate 4 is used as a holding jig in processing a semiconductor wafer 1. The back of a transparent film 5 with viscous bond 6 and 6' applied on both surfaces thereof is adhered on said plate 4, and the semiconductor wafer 1 is fixed by adhering on the face of said film 5 and processed. After processing, ultraviolet rays are applied to harden the viscous bond 6 and 6' and decrease their adhesion, and the semiconductor wafer 1 is removed from the holding jig. If, for example, the viscous bond 6 is made more adhesive than the viscous bond 6' by making the decreases of the adhesions of the viscous bond 6 and 6' after applying ultraviolet rays different from each other, the film 5 can be removed from the plate 4 and then the wafer 1 from the film to facilitate the removal work.
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