| 摘要 |
PURPOSE:To improve flatness of a mask, by a method wherein pressurizing force is applied through an elastic body to one of two jig plates between which a silicon plate, an adhesive and a supporting ring are held, and under this condition, hot bonding is performed. CONSTITUTION:During heating is performed in order to cure a film-like adhesive 4, pressurizing force is applied through an elastic body 11 to one of two jig plates 6, 7 between which a silicon plate 2, the adhesive 4 and a supporting ring 3. Under this condition, bonding process is performed. Accordingly, although the pressurizing force to a mask for X-ray exposure is decreased by a small increasing of a fixed gap distance due to both flow of the film-like adhesive 4 and thermal expansion of a fixture 8, the adhesive 4 can be cured by function of the pressurizing force due to the elastic body 11. As a result, flatness of the resultant mask for X-ray exposure can be less than 2mum. |
