发明名称 MULLITE PASTE AND WIRING SUBSTRATE USING SAID PASTE
摘要 PURPOSE:To enable to form a reinforcing layer necessary to improve metallization intensity by mixing a fixed amount of sintering auxiliary, vehicle and surface modifier into mullite powder so as to make paste. CONSTITUTION:Sintering auxiliary composed of Al2O3, SiO2 and MgO, vehicle and surface modifier are mixed in mullite powder. The use of sintering auxiliary composed of Al2O3, SiO2 and MgO prevents paste from gelling. Especially forming Al2O3, SiO2 and MgCO3 calcined as materials aids pulverization thereof so as not to get easily clogged in printing. Also, because source materials are evenly mixed in the pulverizing process, the dispersibility of powder and the affinity to said vehicle in the paste making process are improved. An insulating layer necessary for multi-layer wiring and a reinforcing layer necessary to improve metallization intensity can be thus formed.
申请公布号 JPH01264105(A) 申请公布日期 1989.10.20
申请号 JP19880091304 申请日期 1988.04.15
申请人 HITACHI LTD 发明人 KUROKI TAKASHI;ISHIHARA SHOSAKU;FUJITA TAKESHI;TSUCHIDA SEIICHI;NOMA TATSUJI
分类号 H01B3/12;H05K3/46 主分类号 H01B3/12
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