Process for producing printed circuit board.

摘要

The present invention provides a process for producing printed circuit boards which comprises the steps of (a) roughening a surface of a copper layer (2) formed on an insulating board (1), (b) coating the roughened surface of copper layer (2) with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist layer, thereby forming plating-resist coats (4) on circuit-negative pattern portions of the copper layer (2), (c) heat-treating the plating-resist coats (4), (d) plating chemically the circuit-corresponding portions with copper (5), (e) removing the plating-resist coats (4), and (f) removing the copper layer (2) except the circuit-corresponding portions thereof. n