发明名称 BONDING DEVICE
摘要 PURPOSE:To control temperature environment accurately by directly detecting the temperature conditions of a body to be bonded at the time of bonding by installing a TV camera picture-recognizing radiant heat from a body surface to be bonded and a discriminating section, etc., deciding the state of the temperature of the body surface within tolerance. CONSTITUTION:A bonding device has a TV camera 32 picture-recognizing radiant heat from body 4, 5 surfaces to be bonded, a discriminating section 34 comparing a processed picture from the TV camera 32 with a threshold picture and deciding the states of the temperatures of the body surfaces within tolerance, and a monitor 35 displaying the processed picture in response to heat distribution on the bodies 4, 5a to be bonded. A signal from the infrared TV camera 32 is changed into a thermal picture signal by a picture processing section 33, and transmitted over the color discriminating section 34. The processed picture from the TV camera is compared with the threshold picture displaying ideal temperature distribution previously input in wire bonding in the color discriminating section 34, and temperature distribution in each section of a lead frame 2 is color-displayed in the monitor 35 on the basis of difference with the threshold picture.
申请公布号 JPH01255237(A) 申请公布日期 1989.10.12
申请号 JP19880083751 申请日期 1988.04.05
申请人 HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD 发明人 KINOSHITA SHIYOUJI
分类号 H01L21/60;H01L21/52 主分类号 H01L21/60
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