| 摘要 |
PURPOSE:To form an insulating layer between org. layers capable of improving the heat-resisting and the electric insulating properties and the sticking property of a film by composing the title composition of a specified photopolymerizable compd., a specified polymerizable compd. and a specified fine particle filler. CONSTITUTION:The photopolymerizable compd. which is composed of at least one kind of a compd. shown by formula I and has one or more of epoxy groups modified with (meth)acrylic acid, the polymerizable compd. having at least two or more of end-ethylenic groups, the photopolymerization initiator capable of generating a radical by an active ray, an epoxy curing agent and the fine particle filler capable of being dissolved and removed by a chemical treatment are incorporated in the photosensitive resin composition. The good insulating layer between the org. layers with the improved heat-resisting and electric insulating properties and sticking property of the film can be obtd. by using the photosensitive resin composition for the insulating layer. In the formula, (n) is >=1. |
