| 摘要 |
PURPOSE:To enable the reflow soldering of high quality by arranging the infrared ray projecting device respectively generating a far infrared ray at a preheating part and a near infrared ray at heating part. CONSTITUTION:The heater generating a far infrared ray is arranged at a preheating part 3 and the lamp generating a near infrared ray is arranged at a heating part 4. A printed board 1 is taken out to the external part by air-cooling it by a fan at a cooling part 5 after soldering it after heating. The preheating is to reduce the crack, etc., of a part and base by making the temp. difference from heating smaller, the board is preferably heated uniformly up to the inner layer wholely and the far infrared ray is fit. At the heating part, it is necessary to heat in short time a solder paste surface, board surface, electronic part, etc., and a near infrared ray is effective. The reflow soldering of high quality having no defective soldering can be obtd. even in case of a metal base substrate. |
