发明名称 FORMING METHOD FOR VIA-HOLE OF CERAMIC MULTILAYER BOARD
摘要 PURPOSE:To stabilize an electric connection of a via-hole and to improve its reliability by filling conductive paste in a through hole formed by coating the inner periphery of the through hole of a green sheet with the paste, and forming the via-hole. CONSTITUTION:A through hole 2 made in the perpendicular direction of a green sheet 1 from its front to its rear is formed at a predetermined position of the sheet 1, conductive paste 3 printed to coat the front face of the sheet 1 is sucked with a strong force from its rear face to coat the inner periphery of the hole 2 with the paste 3, and the through hole is formed. Then, when conductive paste 4 is filled in the through hole, dried and cured, a via-hole is obtained. The via-hole has recesses 5, 5 at the side ends of the hole 3 at the side of opening, and since the volume of the conductive paste filled therein is small, the sizes of the recesses 5, 5 are largely reduced. Thus, an electrically stable connection is obtained, and its reliability can be improved.
申请公布号 JPH01253993(A) 申请公布日期 1989.10.11
申请号 JP19880081837 申请日期 1988.04.01
申请人 MURATA MFG CO LTD 发明人 MORIMOTO RYOICHI;OTA HIROYUKI;HATA TOSHIO;KODO GIICHI
分类号 H05K3/46 主分类号 H05K3/46
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