| 摘要 |
PURPOSE:To obtain an inspection equipment of low cost and high speed, by surrounding the periphery of a semiconductor device as an inspection object with an illuminating apparatus irradiating a light toward inside, dividing said illuminating apparatus into a plurality of sections, and reducing the light in a part of illuminating region of the illuminating apparatus positioning on the inspection side. CONSTITUTION:On the periphery of a light guide 15, branch optical fibers 14a-14d are respectively connected with positions where the guide is equally devided into four segments, thereby dividing an illuminating apparatus 16 into four equal illuminating regions A-D. A control signal from an image processing equipment 3 is given to a shutter unit 13 through a shutter unit control signal line 18. On the other hand, light from a light source 11 is introduced into a main optical fiber 12, independent control of light transmission and cutting of the respective branch optical fibers 14a-14b is performed by the shutter unit 13. In accordance with the place which a bonding wire W electrically connecting the electrode of an IC pellet P as an inspection object and the inner lead of a lead frame F is inspecting, the image processing equipment 3 outputs a signal to cut off the light of its nearest light-scattering part. |
