PROCESS ADAPTED TO THE MANUFACTURE OF BICMOS

摘要

The BiCMOS means a combined semiconductor with high speed Bipolar and large scale CMOS. The manufacturing process of BiCMOS involves: (a) forming p-well after the growth of epitaxy layer on n+ region formed on p-type substrate; (b) depositing the nitride film on the oxide film, and isolating the p+ junction; (c) forming base and collector of bipolar transistor by implanting impurities after growth of CMOS gate oxide; (d) forming a gate of CMOS and emitter of bipolar transistor after depositing oxide film on the n+ layer formed by impurities; (e) forming source and drain of PMOS, NMOS; (F) thermal oxidising or soarce and drain of CMOS, and Aluminium metalization.