| 摘要 |
<p>PURPOSE:To improve a wafer aligning accuracy in a carrier by elevationally inclining the carrier perpendicularly to a wafer, and laterally inclining an orientation flat alignment roller with respect to the carrier. CONSTITUTION:A carrier 2 and an orientation flat roller 3 are inclined elevationally perpendicularly to a wafer 1, and the roller 3 is inclined laterally with respect to the carrier 2 under the carrier 2. Since the carrier 2 is vertically inclined, the top of the wafer 1 is displaced in one direction of a carrier groove 4. However, the lower part of the wafer 1 is not displaced in the same direction as it is to be unstable. Accordingly, when the roller 3 is rotated, the lower parts of the wafers 1 are all displaced in the same direction while aligning the orientation flat parts, and the wafers 1 can be aligned at the upper and lower parts at the same positions of the grooves 4. Thus, the wafer aligning accuracy in the carrier can be improved.</p> |
