| 摘要 |
<p>PURPOSE:To prevent a soldered layer from flowing to a neighboring lead and to avoid production of solder bridge between leads when soldering the lead to the pad part of a mother board by providing a barrier in insulation shape between leads provided at the side wall of a package main body. CONSTITUTION:Terminals 13 consisting of, e.g., fluorocarbon resin as an insulating barrier are provided between leads 12 at the side wall of a package main body 11. Hereupon, the height H1 of the tip of the terminal 13 is a little higher than the height H2 of the tip of a lead 12 when an IC is fixed to the specified position of a mother board 14. When soldering the lead 12 to a pad 15 of the mother board 14, a soldered layer 16 can be prevented from flowing to the neighboring lead 12 and production of a solder bridge between leads 12 can be avoided.</p> |
