发明名称 THIN FILM FORMING EQUIPMENT
摘要 PURPOSE:To prevent the deterioration of interface characteristics, and improve element characteristics, by installing, in the vicinity of a grid, a shutter whose potential is kept equal to the grid, and which is maintained in a closed state until glow discharge is stabilized, and turned into an open state after the glow discharge has been stabilized. CONSTITUTION:A grid 8 is arranged between a cathode 2 and an anode 3, and grounded. A shutter 10, which is arranged in the vicinity of the grid 8 and grounded, is provided with a plurality of thin metal plate 11 of continuous length in a rectangular direction to each wire 9. The shutter 10 is closed; high frequency voltage is applied between the cathode 2 and the grid 8 by a power supply 6; RF glow discharge is generated between the cathode 2 and the grid 8. After the discharge is stabilized, the shutter is opened, and a thin film is formed on the substrate 4. Thereby high energy particles are prevented from colliding against the substrate 4, so that the deterioration of film quality can be prevented.
申请公布号 JPH01243413(A) 申请公布日期 1989.09.28
申请号 JP19880070997 申请日期 1988.03.24
申请人 SANYO ELECTRIC CO LTD 发明人 SAYAMA KATSUNOBU;HAKU HISAO;USUKI TATSURO;TSUDA SHINYA;NAKANO SHOICHI;KUWANO YUKINORI
分类号 C01B33/02;C23C16/50;H01L21/205;H01L31/04 主分类号 C01B33/02
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