| 摘要 |
<p>A jackfield assembly comprising a linear array of electrical jack modules disposed along a longitudinal marginal portion of a printed circuit having a conforming array of apertured areas, each of which includes a predetermined pattern of through-apertures disposed for receiving therein respective wire terminals protruding from a proximal supporting surface of a respective one of the modules for electrical connection to a printed circuit conductor provided on the board. Also, each of the apertured areas includes a through-hole suitably located for receiving a snug-fitting post also extending from the proximal supporting surface of a respective one of the module. Each of the modules has a distal surface provided with a plurality of protruding stubs over which are press-fitted respective through-holes in a rigid interlocking strip which prevents rotational or racking movement of one of the modules relative to the other modules in the array. The modules have respective aligned end surfaces from which protrude a plurality of plug-receiving collars slidably extended through respective apertures in a rigid front panel for preventing lifting movement of one of the modules relative to the other modules in the array.</p> |
