| 摘要 |
PURPOSE:To contrive improvement in pattern printing accuracy by conducting adjustment in an exposure light source system based on the actually measured value of an image-formation surface, namely, the measurements of pattern on a substrate. CONSTITUTION:In order to actually measure the measurements of the pattern on an image-formation surface, a pattern-formed reticle is prepared in advance, for example, the pattern is printed on a substrate using said reticle, and the line width and the like of the pattern on the necessary position of the pattern are actually measured after developing. The microscopic observation means such as an existing scanning electron microscope and the like is used for the actual measurement. The printing of the wafer, which becomes a manufactured article using the actual reticle, is conducted after the exposure light source system has been adjusted based on the actually measured value. As a result, the dimensional variation by the position of the pattern printed on the substrate can be reduced, and the dimensional accuracy of printing can be improved. |
