| 摘要 |
PURPOSE:To make strength up by adhering the protection film surrounding the base end part of an interconnection pin on a multilayered ceramic substrate. CONSTITUTION:A metallization pad 22 is provided on a multilayer ceramic substrate 21. And an interconnection pin 24 is attached on the substrate 21 via the pad 22. A polyimide film 25 is adhered on the substrate 21 and surrounding the base end part 24a of the pin 24. For example, at the time of the attaching/detaching a connector or the checking the substrate 21, even excessive stress is applied to the pin 24, the stress is dispersed to the substrate 21 and the film 25. This eliminates the problem of the destruction of the substrate 21 with the stress applied to the substrate 21 decreased. |
