发明名称 PICK-UP TOOL FOR DIE-BONDING ADHESIVE
摘要 <p>PURPOSE: To transfer the pad of a flexible ribbon while sustaining the pad in a substantially flat state by an arrangement in which a face touching the first surface area of a die adhesive has a second area at least equal to the first surface area and one hole. CONSTITUTION: The pickup 20 for die adhesive is used for transferring the pad 5 of a flexible die adhesive to an adhesion site 6 on a basic material 7. The pickup 20 has a head part 21 to be connected with a rear part 22. The head part 21 has a face 23 touching the die adhesive 5 designed, preferably, larger than the pad 5 of die adhesive being used thereat and to have a shape identical to that of the pad 5. The face 23 is planar or slightly convex. A single passage 25 extends into the rear part 22 and the head part 21 and communicates directly or through an intermediate part 26 with a hole 24 in the face 23. The rear part 22 is a part to be coupled with a vacuum source and when the vacuum source is opened, the passage 25, the intermediate part 26 and the hole 24 are evacuated and the air is sucked through the pickup 20.</p>
申请公布号 JPH01235339(A) 申请公布日期 1989.09.20
申请号 JP19880216446 申请日期 1988.09.01
申请人 E I DU PONT DE NEMOURS & CO 发明人 BAIRON KURISUTOSU SAKIADEISU
分类号 H01L21/52;H01L21/60;H01L21/683;H01L23/495;H05K1/03;H05K3/30 主分类号 H01L21/52
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