| 摘要 |
PURPOSE:To eliminate the mutual electromagnetic interference between a hybrid integrated circuit and external circumstances and increase the scale of the hybrid integrated circuit by a method wherein insulating boards are provided on the inner surfaces of a conductor casing which face each other and circuits are provided on the respective insulating substrates so as to face each other. CONSTITUTION:A closed space 23 is defined by a conductor substrate 16 and a conductor cap 20. Insulating substrates 1a and 1b are provided on the surfaces 16a and 20a in the closed space 23 which face each other respectively while the circuits 18a and 18b on the insulating substrates 1a and 1b are made to face each other. The conductor thin films 14 of the circuits 18a and 18b are welded to the conductor substrate 16 and conductor cap 20 respectively. The grounding lines of the circuits 18a and 18b are connected to a conductor casing 19. Thus, circuits provided around the hybrid integrated circuit are protected from the electromagnetic influence. At the same time, the influence upon the circuits 18a and 18b can be also minimized. With this, the scale of the hybrid integrated circuit can be raised. |
