发明名称 SUBSTRATE FOR THERMAL HEAD AND PREPARATION THEREOF
摘要 PURPOSE:To provide a substrate excellent in heat insulating properties and prevented from becoming high temp. locally and instantaneously, by constituting the heat accumulating layer formed on an insulating substrate of a polyimide resin layer and the titanium oxide layer formed thereon. CONSTITUTION:A titanium alkoxide solution is prepared by a method wherein tetraethoxytitanium [Ti(OC2H5)4] is disolved in ethanol and distilled water is added to the resulting solution to perform reflux for 10hr and the resulting reaction mixture is allowed to stand for a day at room temp. Next, a polyimide coating agent is applied to an alumina substrate (insulating substrate) 1 to form a polyimide resin layer 3 and the above mentioned prepared solution is applied to said polyimide resin layer 3 by spin coating and, after drying, the coating layer is baked at 300 deg.C for 30min. This process is repeated 10 times to form a titanium oxide layer 4 having a thickness of 1mum. Further, a Ta2N layer is formed on the titanium oxide layer 4 by sputtering and an aluminum alloy is vapor-deposited on said layer 5 to be patterned into conductors 6a, 6b and a SiO2 layer 7 is further formed thereon to constitute a thermal head.
申请公布号 JPH01225568(A) 申请公布日期 1989.09.08
申请号 JP19880051266 申请日期 1988.03.04
申请人 OKI ELECTRIC IND CO LTD 发明人 NISHIOKA YOICHI;SATO TOYOSAKU;NAKAYAMA MATSUE
分类号 B41J2/335 主分类号 B41J2/335
代理机构 代理人
主权项
地址