STRUCTURE CONTAINING A LAYER CONSISTING OF POLYIMIDE AND AN INORGANIC FILLER AND METHOD FOR PRODUCING SUCH A STRUCTURE

摘要

A structure comprising on a substrate successive layers of metal circuitry having therebetween as a dielectric a cured polyimide composition containing a polyimide and aluminum oxide or zinc oxide or mixtures thereof. The structure is produced by a method including the following process steps: - blanket screen printing a mixture containing a polyamido carboxylic acid, aluminum oxide or zinc oxide or mixtures thereof and a detackifier with the rest being a solvent on a substrate with a layer of metal circuitry thereon, - drying the deposited layer at a temperature between about 25 and 120 DEG C, - selectively etching holes into the deposited layer where vias between adjacent layers of metal circuitry are needed, - curing the deposited layer at a temperature between about 300 and 400 DEG C and - forming another layer of metal circuitry.