| 摘要 |
PURPOSE:To eliminate positional deviation of a PGA easily and reliably, by forming some of lead pins of the PGA longer than the others, while providing holes in a packaging substrate on which the PGA is to be packaged so that the longer lead pins are inserted in the holes. CONSTITUTION:In order to package a PGA 2 face-to-face on the top face of a packaging substrate 1, solder paste is deposited on the surface of lands 10 formed on the top face of the packaging substrate 1, and the PGA 2 is put on the top face of the packaging substrate 1 while longer lead pins 9a at the four corners of the substrate 3 are inserted in holes 12 of the substrate 1. Thereby, the tip ends of the lead pins 9a are positioned correctly on the respective opposing lands 10 and fixed there temporarily. The packaging substrate 1 having the PGA 2 fixed temporarily is heated in a reflow furnace to melt the solder. Thereby, the lead pins 9 can be bonded to the respective lands 10 correctly without deviation. |
