| 摘要 |
PURPOSE:To easily execute an inspection again without affecting the characteristic of a device by exposing, in a prescribed shape, a photoresist on a semiconductor element in accordance with the result of an inspection. CONSTITUTION:A probe 4 is brought into contact with two or more semiconductor elements 2 manufactured on a semiconductor wafer 1. When the elements 2 are to be inspected, a photoresist 3 is formed in advance on the main surface of the elements 2. In accordance with a good product or a defective product, the resist 3 is exposed by using an exposure beam 5. After completion of this exposure operation, a developing operation is executed; only the resist 3 on the defective elements 2 is left; a good element can be discriminated easily from a defective element during a posterior process. By this setup, it is possible to easily execute an inspection again. |
