VERFAHREN ZUM BESTUECKEN VON BAUELEMENTETRAEGERN MIT BAUELEMENTEN IN OBERFLAECHENMONTAGETECHNIK

摘要

In known processes for mounting components on component supports using surface mounted devices (SMD) technology the components are attached to the predetermined mounting positions, prior to soldering, by means of an adhesive previously applied to the support by a dosing spray device. To prevent adhesion of said device (8), the adhesive is first prepared directly on the mounting positions (30) from low-viscosity components preferably dispensed from the dosing channels (22, 23) of an ink recording mechanism (20, 21).