| 摘要 |
<p>Cooling device or heat pump, comprising a number of vertical, hollow cooling plates (2, 3, 4, 5), a supply pipe for the infeed of cooling medium to the interior of the plates, and a discharge pipe for the discharge of evaporated cooling medium, a trickling device for the supply of the liquid to be cooled to the outer surface of the plates and a collecting tank. To minimize heat stresses and to obtain a compact device the supply pipe (6) is located below the centre of the plates, the discharge pipes are located at the top sides and the connecting tubes (13, 14) are elbows in staggered relation.</p> |
