发明名称 |
Laser scriving system and method |
摘要 |
A laser scribing system and method is described. In the system, a film formed on a substrate is irradiated with laser beam which is focused on a limited portion of the film in order to remove the portion and produce a groove. Laser beam used for eliminating the portion of film formed on a substrate is deprived of its border portion in advance of the focusing. Spherical aberration is suppressed due to this elimination.
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申请公布号 |
US4861964(A) |
申请公布日期 |
1989.08.29 |
申请号 |
US19870097190 |
申请日期 |
1987.09.16 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
SINOHARA, HISATO |
分类号 |
H01S3/10;B23K26/06;B23K26/073;B23K26/36;H01L21/20;H01L21/268;H01L39/24;H05K1/03;H05K3/02;H05K3/38 |
主分类号 |
H01S3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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