| 摘要 |
PURPOSE:To obtain a package which facilitates connection to lines by connecting a conductor connected to an area to the micro strip line provided on the surface through an insulated base material after forming a recess for accommodating a semiconductor chip on a metal substrate, stacking an insulated substrate having a boding area of chip at the entire part including such recess and accommodating chips on the base material. CONSTITUTION:A recess 41 having a rear cover 220 at the bottom surface is formed on a metal base material 22, a semiconductor chip 5 is accommodated therein, and the bonding areas 1, 2, 3 of gate, source, drain and an insulated substrate 40 having a metallized layer 42 at the rear surface are stacked on the entire part including said semiconductor chip. Next, electrode terminals provided to the chip 5 are connected respectively to the areas 1, 2, 3 and these are respectively connected to the gate micro strip line 12 and drain micro-strip line 32 on the substrate 40 through conductors 13 and 33 provided through the insulated substrate 40. |
