发明名称 SUCKING JIG FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To make it possible to use the jig characterized by a low cost and excellent durability stably for a long time, by the constitution wherein the tip part that is in contact with a sucked semiconductor element is formed of ceramic and the surface roughness of the tip part is 0.3-1.5mum. CONSTITUTION:A sucking jig is constituted by linking a ceramic body 1 and a metal body 2 which forms a part to be connected to a moving shank. An air hole 3 is commonly formed along the central axis line. A tapered sucking port 4 that is connected to the air hole 3 is formed at one end part of the ceramic body 1. A joint 5 in an protruding shape is formed at the other end. The ceramic body 1 is formed of the sinter of ceramic such as zirconia(ZrO2), silicon carbide(SiC), silicon nitride (Si3N4) and alumina (Al2O3). The surface of the sucking port 4 of the ceramic body 1 is finished so that the surface roughness is 0.3-1.5mum, desirably 0.3-0.8mum. The angle of the taper of the sucking port 4 is set in the range of 60-120 degrees.
申请公布号 JPH01209739(A) 申请公布日期 1989.08.23
申请号 JP19880034380 申请日期 1988.02.17
申请人 TOSHIBA CORP 发明人 SUZUKI TADASHI
分类号 H01L21/677;H01L21/52;H01L21/68 主分类号 H01L21/677
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