发明名称 METHOD FOR JOINING SPUTTERING TARGET
摘要 PURPOSE:To prevent the development ot cracks in a target by placing a plate made of steel having specific size and weight on the surface of a sputtering target and then carrying out heating and brazing at the time of brazing the target to a backing plate. CONSTITUTION:For example, at the time of brazing a sputtering target 3 made of casting alloy ot Nd, Dy, Fe, and Co types to a backing plate 1 made of copper, a sheet-like brazing filler metal 2 cut into a shape equal to that of the target 3 is placed on the backing plate 1 made of copper in a vessel with vacuum atmosphere, and the target 3 is placed on the above, and a plate 4 made of steel in which surface area ratio and weight ratio are regulated to 70-150% and >=70%, respectively, based on the target 3 is further placed on the above, and then, heating is carried out by means ot a heater 6 to braze the target 3 to the backing plate 1. Since a temp. difference. between the upper and lower surfaces of the target 3 is reduced by the presence of the plate 4 and cooling is slowly carried out by the presence of the plate 4, the occurrence of cracks to the target 3 is prevented, and, as a result, targets can be manufactured in high yield.
申请公布号 JPH01208461(A) 申请公布日期 1989.08.22
申请号 JP19880032199 申请日期 1988.02.15
申请人 SEIKO EPSON CORP 发明人 YAZAKI CHIKAO
分类号 C23C14/34 主分类号 C23C14/34
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