| 摘要 |
A chip component holding plate includes a sheet member composed of silicon rubber, on which a number of quadrilateral through holes each of which is capable of holding a chip component therein are formed. A plate composed of stainless steel is formed on one main surface of the sheet member. On the stainless steel plate, a number of circular through holes each of which has a diameter larger than an inside width of each quadrilateral through holes of the sheet member are formed at positions respectively corresponding to the respective through holes of the sheet member. In the state that the chip components are respectively press-inserted into the respective through holes of the sheet member, the stainless steel plate is magnetically attracted by a magnet plate. Then, the magnet plate is moved so that end portions of the respective chip components being held by the sheet member are pressed onto a silver paste which is spread on a plate, whereby an electrode is applied on the end portion of each chip component.
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