| 摘要 |
<p>PURPOSE:To eliminate assembly defects caused by an assembly tape by a method wherein conductive film leads are bonded to the surface of an insulating tape and the ends of the leads protrude over an aperture provided in the insulating tape and protruding parts are formed on the ends. CONSTITUTION:Ends of conductive film leads 2 protrude over an aperture formed in an insulating film 1 and protruding parts are formed on the parts of the ends which are to be welded to the pads of an integrated circuit chip 4 and the pads of external leads. For instance, the copper foil leads 2 are bonded to the polyimide tape 1 which is an insulating tape and protruding parts are provided at the ends of the leads protruding over the aperture of the polyimide tape 1 by forming semi-etched parts 3 and the protruded parts are bonded to the pads of the IC chip 4 by compression. With this constitution, bonding pressure is applied uniformly to the conductive film leads 2 of the assembly tape so that assembly defects can be eliminated.</p> |
