发明名称 LEAD FRAME
摘要 PURPOSE:To form a lead frame freely and easily by shaping a plurality of lead aggregates, in which a plurality of leads arranged in a plane manner are connected by connecting materials, and disposing the lead aggregates in the plane manner in predetermined positional relationship. CONSTITUTION:Lead aggregates 3, in which the number of leads 1 and the arrangement of the leads 1 are made to differ variously, are shaped, and a plurality of the lead aggregates 3 having the number of specified leads 1 for forming aimed lead frames and the arrangement of the leads 1 are selected from various lead aggregates 3. A plurality of the selected lead aggregates 3 are disposed in a plane manner while being given fixed positional relationship. Consequently, aimed lead frames having the number of the specified leads 1 and the array of the leads 1 are formed in the four quarters, etc. Accordingly, the aimed lead frames having the number of various leads and the arrangement of the leads can freely be shaped easily by using a small number of precision molds.
申请公布号 JPH01202849(A) 申请公布日期 1989.08.15
申请号 JP19880027274 申请日期 1988.02.08
申请人 SHINKO ELECTRIC IND CO LTD 发明人 YONEMOCHI KAZUTO;IMOTO AKIO;HARADA TOKUJI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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