METHOD AND APPARATUS FOR APPLYING A FILM TO A SUBSTRATE SURFACE BY DIODE SPUTTERING

摘要

Diode sputtering apparatus deposits a film on a substrate surface while protecting the substrate against overheating and other adverse effects due to electron bombardment. A magnetic field, transverse to an electric field between the cathode and substrate surface, is rotated about the cathode-substrate axis to deflect electrons submitted from the cathode into paths clear of the substrate surface. Further advantages in uniformity and increased rate of depositions are achieved.