| 摘要 |
PURPOSE:To obtain a solder carrier which can supply a highly accurate small amount of a solder to a semiconductor mounting part having a high-density connection pad part by a method wherein ring-shaped fine protrusions which are situated at positions higher than a sheet face are formed at the outside of open ends on one side of through holes and a mold-releasing agent film not closely adhering to the solder is formed on the sheet face between the protrusions. CONSTITUTION:Through holes 2 are formed in a metal sheet 1; after that, a mold-releasing agent film 3 not closely adhering to a solder is coated thin in recessed parts of the metal sheet partitioned by ring-shaped fine protrusions 1a. Then, a solder foil sheet is placed on the metal sheet face where the fine protrusions 1a have been formed. When this assembly is rolled by using a roll from its upper part, a solder is pushed into 2a through holes. Then, when a solder residue is pulled to the direction of an arrow 7, it is stripped off simply from the recessed parts. During this operation, the solder residue 5a is cut at the fine protrusions 1a at extremely thin outer-ring parts of the protrusions; accordingly, it is not required that the solder residue is removed by a mechanical cutting operation by using a wire brush or the like. |
