发明名称 Blister package
摘要 The invention provides a package having a transparent blister defining a main cavity and a peripheral flange lying in a plane about the cavity. A substrate is attached to the blister so as to close the cavity with the product lying between the blister and the substrate. A laminated substrate having a first layer attached permanently to the flange and a second layer is provided. The first layer has an area printed with information to be retained for use by a purchaser after opening the package, and a score line penetrates the first layer at the edge of this area. When the package is opened the substrate is delaminated about the area and the score line interrupts the delamination leaving this area attached to the second layer and available intact for inspection by the user. The package also has a header portion embodying several features which minimize the risk of damage to the package that would detract from its appearance. These features include reinforcement of the header by means of buttresses integral with the cavity, a hole for receiving a hanger formed by cut-outs in the substrate and blister in which the substrate cut-out is larger than the blister cut-out, and corners where the blister and substrate have differing radii, the radius of the corners of the substrate being larger than in the blister so that the blister extends outwardly beyond the substrate.
申请公布号 US4854450(A) 申请公布日期 1989.08.08
申请号 US19870041063 申请日期 1987.04.22
申请人 TRIDON LIMITED 发明人 FISHER, BRIAN A.
分类号 B65D75/36 主分类号 B65D75/36
代理机构 代理人
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