Multiple wire photosensitive adhesive for wire embedment

摘要

A high density dimensionally stable encapsulated wire circuit board and a method of making such a board is described. A photo-curable adhesive having a unique combination of rheological properties is utilized to bond insulated wires to a substrate. The unique combination of rheological properties of the adhesive used in the encapsulated wire circuit board of this invention include a specified range of values for the Storage Shear Modulus and specified range of values for the Loss Angle ratio. A new photo-curable adhesive having these properties and a method of obtaining such an adhesive are also described.