| 摘要 |
PURPOSE:To prevent the peeling of a barrier metallic film from the surfaces of a protective film, a guard ring layer and a barrier section by positioning the edge section of a barrier metal onto the surface of the guard ring layer and coating the periphery of the barrier metal with an electrode metallic film having excellent adhesive properties. CONSTITUTION:The edge section of a barrier metallic film 4 is positioned onto the surface of a guard ring layer 2, and an electrode 7 having excellent adhesive properties to a semiconductor is brought into contact with the surface of the guard ring layer 2, coating a barrier metallic film 6 on the outside of the edge section of the film 4. Accordingly, the interfaces of the barrier metallic film 4 having inferior adhesive properties and an oxide film or a semiconductor substrate are not exposed, and cut on the surface of the guard ring layer in the semiconductor substrate, and the interface with the substrate is coated with an electrode metallic film having superior adhesive properties with the substrate, thus preventing the generation of a peeling phenomenon. |
