发明名称 PRODUCTION OF METALLIZED GLASS SUBSTRATE
摘要 PURPOSE:To easily form a large-sized uniform metallizing pattern when a metallized glass substrate having a pattern of an electrically conductive layer used to drive a display device is produced by selectively forming an ITO layer on a glass substrate and laminating a Cu layer and an Ni-P layer on the ITO layer by electroless plating. CONSTITUTION:A patterned indium tin oxide(ITO) layer 3 is formed on a glass substrate 1 for a display device such as a liq. crystal display device. The layer 3 is used as an electrode at the display part A and a display element such as a liq. crystal is formed. Metallizing layers 4, 5, 6 are formed on the layer 3 at the driving part B. Lead wires 7, 8 on an IC chip 10 on the central layer 5 are bonded to the left and right layers 4, 6. The metallizing layers at the driving part B are formed by patternwise laminating a Cu layer 9, an Ni-P layer 10 and an Au layer 11 by electroless plating on the ITO layer 3 formed on the substrate 1 with an SiO2 layer 2 inbetween so as to form a bonded metal layer. By adopting electroless plating, the large-sized uniform metallizing pattern can easily be formed.
申请公布号 JPH01195285(A) 申请公布日期 1989.08.07
申请号 JP19880017173 申请日期 1988.01.29
申请人 STANLEY ELECTRIC CO LTD 发明人 YONEDA KOTARO;TSUBOI TOSHIHIKO
分类号 C23C18/18;C23C16/30;C23C16/40;C23C16/56;C23C18/32;C23C18/38;C23C18/52;G02F1/13;G02F1/1343;G09F9/30;H01B5/14;H01B13/00;H01L23/15;H01L23/498;H05K3/24 主分类号 C23C18/18
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