| 摘要 |
PURPOSE:To perform high grade printing while simplifying assembling manufacturing and stabilizing the lead-out of a lead, by a method wherein a membrane thermal head part is mechanically bonded to one end surface of an insulating substrate in such a state that the terminal lead-out part of a circuit part is superposed on the corresponding wiring pattern of the insulating substrate to be electrically connected thereto. CONSTITUTION:A membrane thermal head part 13 is constituted by providing a heat generating part 11, a circuit part 12 and a circuit element 17 on a glass substrate 18. For example, a semiconductor 21 composed of silicon is formed and the heat generating part 11 is formed, for example, of a polycrystalline silicon layer doped with impurities at low concn. In the membrane thermal head part 13 thus constituted, the pad part 15 thereof is bonded on the extension of the end surface 14A of the substrate 14 of the corresponding wiring pattern 16 and the membrane thermal head part 13 is bonded to the end surface 14A electrically and mechanically. By this method, the glass substrate 18 is positioned on the side opposite to the substrate 14. |
