| 摘要 |
PURPOSE:To form a polyimide pattern without generating cracks therein by coating a nonphotosensitive polyimide resin precursor on a substrate, prebaking the coating, further coating a photosensitive polyimide resin precursor thereon and prebaking the coating, then subjecting the coating to exposing, developing and after-baking. CONSTITUTION:The nonphotosensitive polyimide resin precursor 5 is applied on the substrate 1 so as to attain 10-200mum thickness after curing and is prebaked. The photosensitive polyimide resin precursor 6 is applied on the prebaked layer so as to attain <=100mum applying thickness and is prebaked. The coating is thereafter subjected to exposing, developing and after-baking. The polyimide patterns of the thick film having excellent heat resistance is thereby formed without forming cracks and excellent chemical resistance, insulating characteristic, mechanical characteristics, etc., are obtd. |
