| 摘要 |
<p>PURPOSE:To improve manufacturing efficiency by a method wherein improvement is introduced into the process of creating scratches to serve as the starting point of cleavage at a wafer edge and the operating speed is accelerated of a diamond scriber. CONSTITUTION:A covering material 8 of approximately 15mum-thick Al foil is attached to the upper surface of a wafer 1 and a part of the leading edge of a wafer 1 is exposed, allowed to protrude from the leading edge of the covering material 8. Over a table 5, a diamond scriber 6 is positioned, driven up and down and back and forth. A diamond stylus 7 belonging to the diamond scriber 6 comes down onto the covering material 8, near the trailing edge of the wafer 1 at a spot outside the wafer 1. The stylus 7 is caused to travel over the wafer 1 forward, to create a scatch 3 on the portion of the leading edge of the wafer 1 protruding from the leading edge of the covering material 8. While the diamond scriber 6 is being reset, the table 5 travels by one pitch. Similar operations are repeated for the formation of scratches 3 spaced at a constant pitch.</p> |
